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반도체 및 디스플레이 열처리 장비

HVCD OVEN

RTP-300

Vertical Furnace



 



Thermal Convection BAKE OVEN

 

 

Specification 

 Dimension

W : 1800 D : 1500 H : 1600 

 Max, 온도

350°C

 온도분포

< ± 5℃ keeping

 히터

 Sheath Heater

 청정도

 Class100 (0.3㎛)

 GAS

 CDA + O2 + N2

 Door

 Auto Shutter

 Cassette

 3slot / 40mm Pitch

 

 

 



Thermal Convection BAKE OVEN

 

  

Specification 

 Dimension

W : 1800 D : 1500 H : 1800 

 Max, 온도

480°C

 온도분포

<± 5℃ keeping

 히터

 Sheath Heater

 청정도

 -

 GAS

 CDA + N2

 Door

 Cylinder U/D

 Cassette

 10slot / 35mm Pitch

 

 



 



Hot Plate

 

 

Specification 

 Dimension

W : 640 D : 800 H : 1100 

 Max, 온도

150°C

 온도분포

 <± 2℃ keeping

 Type

 Proximity Backing

 히터

 MICA Heater

 GAS

 CDA + N2

 Plate

 AI Hard Anodizing

 Substrate

 365 X 460 0.3 ~ 1.1T

        

  

 




4.5G OLED HVCD

 

 

Specification

 ITEMS

 DESCRIPTION

 Chamber

Type 

 Batch

 

ChamberInner Size

 850(W) x 1,040(D) x 210(H) (1Chamber)

Chamber Inner Volume

 Approx. 200 ℓ

 Substrate

Size W x D x H (mm)

 730 x 920 x 0.5t (Loading Direction : 730W)

 Frame

Frame Size

 1,570(W) x 1960(L) x 1,762(H)

Power Box

 Excluding main frame

Control Box

 Including main frame

 Temp.

Process Temp. Range

 30~100℃ (on Substrate)

Max Temp. 

 120℃

 

Temp. Distribution (℃)

 ±2℃ (holding)

 

 Vacuum

Operating Vacuum Range

 5 ~ 20 Pa (38 ~ 150 mTorr)

Ultimate Vacuum Pressure

 0.8 Pa (6 mTorr)

 

 Process

Solvent

 Max 80ml (Considered as PGMEA 100%)

Vent Time

 ≒ 40 sec

 

 Tact Time :

180 sec

Transport Time

 ≒ 35 sec

Pump-down Time

 ≒ 45 sec

(4 Pa/30 mTorr)

Keeping Time

 ≒ 60 sec
(5~20 Pa/38~150 mTorr)

 Pump

Roughing Pump

 Kashiyama (SDL12E50) (25,000 liter/min)

 Pass Line (mm)

 FL+1,400mm From Floor (±10mm)

 Weight (ton)

 Approx. 2.5 ton (including dry pump)






2.5G OLED 2단 HVCD

 

 

Specification

 ITEMS

 DESCRIPTION

 Chamber

Outer Size

 750(W) x 755(D) x 300(H)

Inner Size

 670(W) x 675(D) x 200(H)

Chamber Inner Volume

 Approx. 200 ℓ

 Substrate

Size W x D x H (mm)

 730 x 920 x 0.5t (Loading Direction : 730W)

 Frame

Frame Size

 1,570(W) x 1960(L) x 1,762(H)

Power Box

 Excluding main frame

Control Box

 Including main frame

 Temp.

Process Temp. Range

 30~100℃ (on Substrate)

Max Temp. 

 120℃

 

Temp. Distribution (℃)

 ±2℃ (holding)

 

 Vacuum

Operating Vacuum Range

 5 ~ 20 Pa (38 ~ 150 mTorr)

Ultimate Vacuum Pressure

 0.8 Pa (6 mTorr)

 

Leakage Rate

 ≤ 1 mTorr/min

 

 Process

Solvent

 Max 30ml (Considered as PGMEA 100%)

Vent Time

 ≒ 40 sec

 

 Tact Time :

230 sec

(transport time is not included)

Transport Time

 ≒ 30 sec

Pump-down Time

 ≒ 80 sec

(4 Pa/30 mTorr)

Keeping Time

 ≒ 80 sec
(5~50 Pa/38~380 mTorr)

 Pump

Roughing Pump

 Kashiyama (SDL1203X) (20,000 liter/min)

 Pass Line (mm)

 FL+1,200mm From Floor (±10mm)