반도체 및 디스플레이 열처리 장비
HVCD OVEN
RTP-300
Vertical Furnace
Thermal Convection BAKE OVEN |
Specification
Dimension | W : 1800 D : 1500 H : 1600 |
Max, 온도 | 350°C |
온도분포 | < ± 5℃ keeping |
히터 | Sheath Heater |
청정도 | Class100 (0.3㎛) |
GAS | CDA + O2 + N2 |
Door | Auto Shutter |
Cassette | 3slot / 40mm Pitch |
Thermal Convection BAKE OVEN |
Specification
Dimension | W : 1800 D : 1500 H : 1800 |
Max, 온도 | 480°C |
온도분포 | <± 5℃ keeping |
히터 | Sheath Heater |
청정도 | - |
GAS | CDA + N2 |
Door | Cylinder U/D |
Cassette | 10slot / 35mm Pitch |
Hot Plate |
Specification
Dimension | W : 640 D : 800 H : 1100 |
Max, 온도 | 150°C |
온도분포 | <± 2℃ keeping |
Type | Proximity Backing |
히터 | MICA Heater |
GAS | CDA + N2 |
Plate | AI Hard Anodizing |
Substrate | 365 X 460 0.3 ~ 1.1T |
4.5G OLED HVCD |
Specification
ITEMS |
DESCRIPTION |
||
Chamber |
Type |
Batch |
|
ChamberInner Size |
850(W) x 1,040(D) x 210(H) (1Chamber) |
||
Chamber Inner Volume |
Approx. 200 ℓ |
||
Substrate |
Size W x D x H (mm) |
730 x 920 x 0.5t (Loading Direction : 730W) |
|
Frame |
Frame Size |
1,570(W) x 1960(L) x 1,762(H) |
|
Power Box |
Excluding main frame |
||
Control Box |
Including main frame |
||
Temp. |
Process Temp. Range |
30~100℃ (on Substrate) |
|
Max Temp. |
120℃ |
|
|
Temp. Distribution (℃) | ±2℃ (holding) |
| |
Vacuum |
Operating Vacuum Range |
5 ~ 20 Pa (38 ~ 150 mTorr) |
|
Ultimate Vacuum Pressure |
0.8 Pa (6 mTorr) |
|
|
Process |
Solvent |
Max 80ml (Considered as PGMEA 100%) |
|
Vent Time |
≒ 40 sec |
Tact Time : 180 sec |
|
Transport Time |
≒ 35 sec |
||
Pump-down Time |
≒ 45 sec (4 Pa/30 mTorr) |
||
Keeping Time |
≒ 60 sec |
||
Pump |
Roughing Pump |
Kashiyama (SDL12E50) (25,000 liter/min) |
|
Pass Line (mm) |
FL+1,400mm From Floor (±10mm) |
||
Weight (ton) |
Approx. 2.5 ton (including dry pump) |
2.5G OLED 2단 HVCD |
Specification
ITEMS |
DESCRIPTION |
||
Chamber |
Outer Size |
750(W) x 755(D) x 300(H) |
|
Inner Size |
670(W) x 675(D) x 200(H) |
||
Chamber Inner Volume |
Approx. 200 ℓ |
||
Substrate |
Size W x D x H (mm) |
730 x 920 x 0.5t (Loading Direction : 730W) |
|
Frame |
Frame Size |
1,570(W) x 1960(L) x 1,762(H) |
|
Power Box |
Excluding main frame |
||
Control Box |
Including main frame |
||
Temp. |
Process Temp. Range |
30~100℃ (on Substrate) |
|
Max Temp. |
120℃ |
|
|
Temp. Distribution (℃) | ±2℃ (holding) |
| |
Vacuum |
Operating Vacuum Range |
5 ~ 20 Pa (38 ~ 150 mTorr) |
|
Ultimate Vacuum Pressure |
0.8 Pa (6 mTorr) |
|
|
Leakage Rate |
≤ 1 mTorr/min |
|
|
Process |
Solvent |
Max 30ml (Considered as PGMEA 100%) |
|
Vent Time |
≒ 40 sec |
Tact Time : 230 sec (transport time is not included) |
|
Transport Time |
≒ 30 sec |
||
Pump-down Time |
≒ 80 sec (4 Pa/30 mTorr) |
||
Keeping Time |
≒ 80 sec |
||
Pump |
Roughing Pump |
Kashiyama (SDL1203X) (20,000 liter/min) |
|
Pass Line (mm) |
FL+1,200mm From Floor (±10mm) |
㈜에스아이 | ceo : 김종훈
TEL : 031-8059-2864 | FAX : 031-8059-2865
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